Two step metallization formation

ABSTRACT

An integrated circuit structure includes a first conductive line, a dielectric layer over the first conductive line, a diffusion barrier layer in the dielectric layer, and a second conductive line in the dielectric layer. The second conductive line includes a first portion of the diffusion barrier layer. A via is underlying the second conductive line and electrically couples the second conductive line to the first conductive line. The via includes a second portion of the diffusion barrier layer, with the second portion of the diffusion barrier layer having a bottom end higher than a bottom surface of the via.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a division of U.S. patent application Ser. No.14/523,256, filed on Oct. 24, 2014, entitled “Two Step MetallizationFormation,” which application is hereby incorporated herein byreference.

BACKGROUND

Integrated circuit devices such as transistors are formed onsemiconductor wafers. The devices are interconnected through metal linesand vias to form functional circuits, wherein the metal lines and viasare formed in back-end-of-line processes. To reduce the parasiticcapacitance of the metal lines and vias, the metal lines and vias areformed in low-k dielectric layers, which typically have k values lowerthan 3.8, lower than 3.0, or lower than 2.5.

In the formation of the metal lines and vias in a low-k dielectriclayer, the low-k dielectric layer is first etched to form trenches andvia openings. The etching of the low-k dielectric layer may involveforming a patterned hard mask over the low-k dielectric material, andusing the patterned hard mask as an etching mask to form trenches. Viaopenings are also formed and substantially aligned to the trenches. Thetrenches and the via openings are then filled with a metallic material,which may comprise copper. A Chemical Mechanical Polish (CMP) is thenperformed to remove excess portions of the metallic material over thelow-k dielectric layer.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1 through 13 illustrate the cross-sectional views of intermediatestages in the formation of an interconnect structure in accordance withsome embodiments; and

FIG. 14 illustrates a process flow for forming an interconnect structurein accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “underlying,” “below,”“lower,” “overlying,” “upper” and the like, may be used herein for easeof description to describe one element or feature's relationship toanother element(s) or feature(s) as illustrated in the figures. Thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. The apparatus may be otherwiseoriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein may likewise be interpretedaccordingly.

Interconnect structures of integrated circuits and the methods offorming the same are provided in accordance with various exemplaryembodiments. The intermediate stages of forming the interconnectstructures are illustrated. The variations of the embodiments arediscussed. Throughout the various views and illustrative embodiments,like reference numbers are used to designate like elements.

FIGS. 1 through 13 illustrate the cross-sectional views of intermediatestages in the formation of interconnect structures of integratedcircuits in accordance with some embodiments. The steps shown in FIGS. 1through 13 are also shown in the process flow 200 in FIG. 14.

FIG. 1 illustrates wafer 100, which includes semiconductor substrate 20and the features formed over semiconductor substrate 20. In accordancewith some embodiments of the present disclosure, semiconductor substrate20 comprises crystalline silicon, crystalline germanium, silicongermanium, a III-V compound semiconductor such as GaAsP, AlInAs, AlGaAs,GaInAs, GaInP, GaInAsP, and/or the like. Semiconductor substrate 20 mayalso be a bulk silicon substrate or a Silicon-On-Insulator (SOI)substrate.

In accordance with some embodiments of the present disclosure, wafer 100is used to form a device die. In these embodiments, integrated circuitdevices 22 are formed on the top surface of semiconductor substrate 20.Exemplary integrated circuit devices 22 may include ComplementaryMetal-Oxide Semiconductor (CMOS) transistors, resistors, capacitors,diodes, or the like. The details of integrated circuit devices 22 arenot illustrated herein. In alternative embodiments, wafer 100 is usedfor forming interposers. In these embodiments, no active devices such astransistors and diodes are formed on substrate 20. There may (or maynot) be passive devices such as capacitors, resistors, inductors, or thelike formed in wafer 100. Substrate 20 may also be a dielectricsubstrate in the embodiments in which wafer 100 is an interposer wafer.Furthermore, through-vias (not shown) may be formed to penetrate throughsubstrate 20 in order to interconnect the components on the oppositesides of substrate 20.

Inter-Layer Dielectric (ILD) 24 is formed over semiconductor substrate20 and fills the space between the gate stacks of transistors (notshown) in integrated circuit devices 22. In some exemplary embodiments,ILD 24 comprises phosphosilicate glass (PSG), borosilicate glass (BSG),boron-doped phosphosilicate glass (BPSG), fluorine-doped silicate glass(FSG), tetraethyl orthosilicate (TEOS), or the like. ILD 24 may beformed using spin coating, Flowable Chemical Vapor Deposition (FCVD), orthe like. In alternative embodiments of the present disclosure, ILD 24is formed using a deposition method such as Plasma Enhanced ChemicalVapor Deposition (PECVD), Low Pressure Chemical Vapor Deposition(LPCVD), or the like.

As also shown in FIG. 1, etch stop layer 26 is formed over ILD 24 andintegrated circuit devices 22, if any. Etch stop layer 26 may comprisesilicon carbide, silicon nitride, silicon oxynitride, siliconcarbo-nitride, or the like. Etch stop layer 26 is formed of a materialthat has a high etching selectivity with the overlying dielectric layer30, and hence etch stop layer 26 may be used to stop the etching ofdielectric layer 30.

Contact plugs 28 are formed in ILD 24 and are used to electricallyconnect to integrated circuit devices 22. For example, contact plugs 28may include gate contact plugs that are connected to the gate electrodesof transistors (not shown) in integrated circuit devices 22 andsource/drain contact plugs that are electrically connected to thesource/drain regions of the transistors. In accordance with someembodiments of the present disclosure, contact plugs 28 are formed of amaterial selected from tungsten, aluminum, copper, titanium, tantalum,titanium nitride, tantalum nitride, alloys therefore, and/ormulti-layers thereof. The formation of contact plugs 28 may includeetching ILD 24 to form contact openings, filling a conductivematerial(s) into the contact openings until the conductive materialfills the entireties of the contact openings, and performing aplanarization (such as Chemical Mechanical Polish (CMP)) to level thetop surfaces of contact plugs 28 with the top surface of ILD 24.

Further illustrated in FIG. 1 is dielectric layer 30, which isalternatively referred to as Inter-Metal Dielectric (IMD) layer 30hereinafter. In accordance with some embodiments of the presentdisclosure, IMD layer 30 is formed of a low-k dielectric material havinga dielectric constant (k-value) lower than about 3.0, about 2.5, or evenlower. IMD layer 30 may comprise Black Diamond (a registered trademarkof Applied Materials), an oxygen-containing and/or carbon containinglow-k dielectric material, Hydrogen SilsesQuioxane (HSQ),MethylSilsesQuioxane (MSQ), or the like.

Conductive lines 32 are formed in IMD 30. In accordance with someembodiments, conductive lines 32 include diffusion barrier layers 34 andcopper-containing material 36 over diffusion barrier layers 34.Diffusion barrier layers 34 may include titanium, titanium nitride,tantalum, tantalum nitride, or the like, and have the function ofpreventing copper in copper-containing material 36 from diffusing intoIMD 30. Conductive lines 32 are referred to as metal lines 32hereinafter.

In accordance with some embodiments of the present disclosure, metalcaps 38 are formed over metal lines 32. Metal caps 38 may also beconsidered as parts of metal lines 32 throughout the description. Insome embodiments, metal caps 38 include cobalt (Co), CoWP, CoB, tungsten(W), tantalum (Ta), nickel (Ni), molybdenum (Mo), titanium (Ti), iron(Fe), or alloys thereof. Metal caps 38 may be formed selectively usingElectroChemical Plating (ECP) or electroless plating, during which wafer100 is submerged in a plating solution. In alternative embodiments,metal caps 38 are blanket formed on metal lines 32 and IMD layer 30,followed by an etching process to remove undesirable portions. FIG. 1illustrates that metal lines 32 are in a bottom metal layer, which isthe metal layer immediately over contact plugs 28. The illustrated metallines 32 also represent metal lines in any metal layer that is over thebottom metal layer.

Referring to FIG. 2, etch stop layer 40 and IMD layer 42 are formed. Inaccordance with some embodiments, etch stop layer 40 is formed ofsilicon carbide, silicon nitride, silicon oxynitride, siliconcarbo-nitride, or the like. Etch stop layer 40 is in contact with metalcaps 38 and IMD layer 30. IMD layer 42 may be formed of a material thatis selected from the same candidate materials for forming IMD layer 30.For example, IMD layer 42 may be formed of an oxygen-containing and/orcarbon-containing dielectric material, Black Diamond, HSQ, MSQ, or thelike. IMD layer 42 may also have a low-k value, which may be lower thanabout 3.0, 2.5, or 2.0. In some embodiments of the present disclosure,the formation of IMD layer 42 includes depositing a porogen-containingdielectric material and then performing a curing process to drive outthe porogen, and hence the remaining IMD layer 42 becomes porous.

Referring to FIGS. 3 and 4, trenches 46 and via opening 44 are formed inIMD layer 42. The respective process steps are shown as step 202 in theprocess flow shown in FIG. 14. In accordance with some embodiments ofthe present disclosure, the formation processes include performing aphoto lithography process to etch IMD layer 42 in order to form initialvia opening such as the via opening 44 in FIG. 3, wherein the initialvia opening 44 extends from the top surface of IMD layer 42 to anintermediate level between the top surface and the bottom surface of IMDlayer 42. Next, a metal hard mask (not shown) is formed and patterned todefine the patterns of trenches 46 as shown in FIG. 4. As shown in FIG.4, an anisotropic etching is then performed to etch IMD layer 42 inorder to form trenches 46. At the same time trenches 46 are formed, viaopening 44 extends down to etch stop layer 40. Etch stop layer 40 isthen etched to expose the underlying metal cap(s) 38, hence forming viaopening 44 as illustrated. The etching step for forming trenches 46 maybe performed using a time-mode, and may be stopped after the etching hasbeen performed for a pre-set period of time. Other etch and stop pointdetection techniques are also contemplated. In alternative embodiments,via opening 44 and trenches 46 are formed in separate photo lithographyprocesses. For example, in a first photo lithography process, trenches46 are formed to extend to an intermediate level of IMD layer 42. In asecond lithography process, via opening 44 is formed to extend all theway down to etch stop layer 40.

In accordance with some embodiments of the present disclosure, theetching of IMD layer 42 is performed using a process gas comprisingfluorine and carbon, wherein fluorine is used for etching, with carbonprotecting the sidewalls of the resulting via opening 44 and trenches46. With an appropriate fluorine-to-carbon ratio, via openings 44 andtrenches 46 may have desirable profiles. For example, the process gasesfor the etching include a fluorine and carbon containing gas(es) such asC₄F₈ and/or CF₄ and a carrier gas such as N₂. In alternativeembodiments, the process gases for the etching include CH₂F₂ and acarrier gas such as N₂. During the etching of IMD layer 42, wafer 100may be maintained at a temperature between about 30° C. and 60° C. TheRadio Frequency (RF) power of the power source used for the etching maybe lower than about 700 Watts, and the pressure of the process gases maybe in the range from about 15 mtorr to about 30 mtorr.

After the formation of via opening 44 and trenches 46, metal line 32 ormetal cap 38 (if any left) is exposed to via opening 44. Due to thebombardment effect in the formation of via opening 44, some portions ofmetal caps 38 may be removed in some embodiments, hence the underlyingconductive material 36 may be exposed. In other embodiments, metal cap38 includes a portion covering metal lines 32 after the formation of viaopening 44.

Referring to FIG. 5, a selective plating is performed to form via 48 invia opening 44, but not on the exposed surfaces of dielectric layer 42.The respective process step is shown as step 204 in the process flowshown in FIG. 14. In accordance with some embodiments of the presentdisclosure, the selective plating is performed using ECP. In accordancewith alternative embodiments, the selective plating is performed usingelectroless plating. Via 48 includes a main metallic material doped withan additive element(s). The main metallic material may include copper,cobalt, or an alloy of copper and cobalt. In some exemplary embodiments,the atomic percentage of the main metallic material in via 48 is higherthan about 80 percent, 90 percent, or even higher. The additive elementmay be a metallic element including manganese (Mn), magnesium (Mg),titanium (Ti), or alloys of these elements in different combinations.

Via opening 44 has depth D1, which is measured from the bottom surfaceof the respective trench 46 to the bottom of via openings 44. Height H1of via 48 is smaller than depth D1 of via opening 44. Accordingly, thetop surface of via 48 is lower than the bottom surfaces of trenches 46.In some embodiments, the difference (D1−H1) is greater than about 50 nm.Furthermore, ratio H1/D1 may be smaller than about ¾ to ensure there isenough difference between depth D1 and height H1.

FIG. 6 illustrates the formation (the deposition) of diffusion barrierlayer 50 on the exposed surface of wafer 100. The respective processstep is shown as step 206 in the process flow shown in FIG. 14. Inaccordance with some embodiments, the formation of diffusion barrierlayer 50 includes Physical Vapor Deposition (PVD). In some exemplarydeposition process, argon (Ar) is introduced into the respectivedeposition chamber (not shown), in which wafer 100 is placed, to sputtermetal ions (such as titanium or tantalum (Ta⁺)) or atoms without charges(such as titanium or tantalum (Ta⁰)) from the respective target (notshown) used in the PVD. Nitrogen may be added into the process gases.The sputtered metal ions are deposited onto wafer 100, forming diffusionbarrier layer 50, which is conductive. Diffusion barrier layer 50 mayhave a thickness in the range from about 2 nm to about 10 nm. In thedeposition of diffusion barrier layer 50, a DC power and/or a RadioFrequency (RF) power may be applied.

Diffusion barrier layer 50 includes portions 50 ₁ directly over low-kdielectric layer 42, portions 50 ₂ on the sidewalls of trenches 46,portion 50 ₃ at the bottom of via opening 44, portions 50 ₄ on thebottoms of trenches 46, and portions 50 ₅ on the sidewalls of viaopening 44.

Referring to FIG. 7, a re-sputter of diffusion barrier layer 50 isperformed, wherein some portions of diffusion barrier layer 50 aresputtered away. The respective process step is shown as step 208 in theprocess flow shown in FIG. 14. The re-sputter may be performed using thesame production tool that is used for performing the step in FIG. 6.Furthermore, the step shown in FIG. 7 may be performed in-situ with thestep shown in FIG. 6, with no vacuum break therebetween. In accordancewith some embodiments of the present disclosure, the transition from thedeposition of diffusion barrier layer 50 to the re-sputter of diffusionbarrier layer 50 is achieved by adjusting process conditions. Forexample, the transition from the deposition of diffusion barrier layer50 to the re-sputter of diffusion barrier layer 50 may be achieved byadjusting DC and RF power used in the deposition of diffusion barrierlayer 50 to different values.

In some embodiments, the re-sputter of diffusion barrier layer 50 isperformed by turning off or down the power of the DC power source, andturning on (if not turned on in the deposition of diffusion barrierlayer 50) or up the power of the RF power source used in the depositionof diffusion barrier layer 50. In addition, the flow rate and/or thepartial pressure of sputtering gases such as argon may be increased toenhance the re-sputtering effect. As a result, the re-sputter effect isenhanced. Metal ions (such as titanium or tantalum (Ta⁺)) or atomswithout charges (such as titanium or tantalum (Ta⁰)) are sputter awayfrom diffusion barrier layer 50.

In the resulting structure in FIG. 7, thickness T1 of sidewall portions50 ₂ of diffusion barrier layer 50 has a great value, which may begreater than bout 5 nm, and may be in the range from about 5 nm to about10 nm. The advantageous features of the thick sidewall portions ofdiffusion barrier layer 50 are discussed in subsequent paragraphs.

As a result of the re-sputter, the bottom portion 50 ₃ (FIG. 6) ofdiffusion barrier layer 50 is removed from the bottom of the remainingvia opening 44, as shown in FIG. 7. The re-sputtered ions may bedeposited on the top portions 50 ₁ and sidewall portions 50 ₂, causingthe thickness of these portions to increase. In the meantime, portions50 ₄ of diffusion barrier layer 50 at the bottom of trenches 46 are alsore-sputtered. However, at the time the ions are re-sputtered away fromportions 50 ₄, the re-sputtered ions are also deposited on portions 50 ₄simultaneously. Portions 50 ₄ of diffusion barrier layer 50 hence remainafter the re-sputter.

In accordance with the embodiments of the present disclosure, in orderto ensure that diffusion barrier layer 50 is removed from the bottom ofvia opening 44, but not from the bottom of trenches 46, the bottomsurface 44A of via opening 44 is lower than the bottom surface 46A ofthe respective trench. In the resulting structure, the bottom ends 50Aof diffusion barrier layer 50 extend to the top surface of via 48.Hence, the bottom portion of the original via opening as in FIG. 4 isnot filled with diffusion barrier layer 50.

FIG. 8 illustrates the filling of conductive material 52 into theremaining via opening 44 and trenches 46 (FIG. 7), hence forming via 54and conductive lines 56. The respective process step is shown as step210 in the process flow shown in FIG. 14. Conductive material 52 may bea metallic material including a metal or a metal alloy such as copper,silver, gold, tungsten, aluminum, or alloys thereof. In someembodiments, the formation of via 54 and conductive lines 56 includesdepositing a thin seed layer (not shown), which may include copper or acopper alloy, and filling the rest of via opening 44 and trenches 46(FIG. 7) using, for example, ECP or electro-less plating. A depositionmethod may also be contemplated. A CMP may be performed to remove excessconductive material 52 and diffusion barrier layer 50, so that the topsurface of conductive material 52 is level with or substantially levelwith the top surface of IMD layer 42.

Via 54 includes lower portion 48 (also referred to as 54B) and an upperportion 54A. Upper portion 54A includes a portion of conductive material52 and a portion of diffusion barrier layer 50 encircling conductivematerial 52, wherein diffusion barrier layer 50 spaces apart, and is incontact with, conductive material 52 and IMD layer 42. Lower portion 54Bdoes not include diffusion barrier layer 50. In some embodiments, lowerportion 54B and upper portion 54A are formed of the same material (forexample, with the same elements and having same percentages of theelements), and hence the lower portion 54B and upper portion 54A do nothave a distinguishable interface. The bottom ends 50A of diffusionbarrier layer 50 are level with or substantially level with the topsurface of lower portion 54B. In alternative embodiments, lower portion54B and upper portion 54A are formed of different materials such asdifferent metals, and hence there is a distinguishable interface betweenlower portion 54B and upper portion 54A.

Each of conductive lines 56 (including 56A, 56B, and 56C) includesdiffusion barrier layer 50 and conductive material 52 over a bottomportion of diffusion barrier layer 50 and encircled by the sidewallportions of diffusion barrier layer 50.

FIGS. 9 through 11 illustrate the intermediate stages in the formationof an opening between two neighboring conductive lines 56B and 56C. Therespective process steps are shown as step 212 in the process flow shownin FIG. 14. Referring to FIG. 9, etch stop layer 57 is formed. Etch stoplayer 57 may comprise silicon carbide, silicon nitride, siliconoxynitride, silicon carbo-nitride, or the like. Next, mask layer 64 isapplied over wafer 100 and patterned. In accordance with someembodiments, mask layer 64 includes a tri-layer, which includes underlayer 58, middle layer 60 over under layer 58, and upper layer 62 overmiddle layer 60. In alternative embodiments, mask layer 64 is asingle-layer photo resist or a double-layer. In some embodiments, underlayer 58 and upper layer 62 are formed of photo resists, which includeorganic materials. Under layer 58 may have a thickness between, forexample, about 1,000 Å and about 2,000 Å. Middle layer 60 may include aninorganic material, which may be a nitride (such as silicon nitride), anoxynitride (such as silicon oxynitride), an oxide (such as siliconoxide), or the like. Middle layer 60 may also include the mix of siliconand an organic material. Middle layer 60 may have a thickness between,for example, about 300 Å and about 400 Å. Upper layer 62 may have athickness between, for example, about 500 Å and about 700 Å. Middlelayer 60 has a high etching selectivity relative to upper layer 62 andunder layer 58, and hence upper layer 62 may be used as an etching maskfor the patterning of middle layer 60, and middle layer 60 may be usedas an etching mask for the patterning of under layer 58.

The pattern in upper layer 62 is transferred to the underlying middlelayer 60 and under layer 58, which are used to etch layer 57 and IMDlayer 42. The resulting structure is shown in FIG. 10, wherein upperlayer 62 in FIG. 9 has been consumed. Opening 66 is formed betweenneighboring conductive lines 56B and 56C, which are closely located fromeach other. The etchant for etching IMD layer 42 is selected to have ahigh etching selectivity, so that in the etching of IMD layer 42, thedamage to conductive lines 56B and 56C are minimized. Opening 66 mayhave a bottom level with or substantially level with the bottom surfacesof conductive lines 56B and 56C in some embodiments. In alternativeembodiments, the bottom of opening 66 is higher than or lower than thebottom surfaces of conductive lines 56B and 56C.

Although there is a high etching selectivity, the sidewall portions ofdiffusion barrier layer 50 exposed to opening 66 may still be damaged.For example, thickness T2 of diffusion barrier layer 50 may be reducedfrom the original thickness T1. The sidewall portions of diffusionbarrier layer 50 exposed to opening 66 needs to remain after theformation of opening 66 in order to function to prevent diffusion.Accordingly, thickness T1 needs to be great enough, for example, greaterthan about 5 nm, so that the resulting thickness T2 of the damagedportions of diffusion barrier layer 50 is greater than 0 nm, or greaterthan about 0.5 nm to be effective.

The remaining mask layer 64 is then removed, and the resulting structureis shown in FIG. 11. Next, as shown in FIG. 12, dielectricmaterial/layer 67 and air gap 68 are formed. The respective process stepis shown as step 214 in the process flow shown in FIG. 14. In accordancewith some embodiments, dielectric material 67 is a low-k dielectricmaterial, which may be selected from the same group of candidatematerials of IMD layer 42. Dielectric material 67 and IMD layer 42 mayalso be formed of different dielectric materials. Conductive lines 56Band 56C are closely located from each other, and hence the aspect ratioof opening 66 (FIG. 11) is high. Accordingly, after the formation ofdielectric layer 67, air gap 68 is formed between conductive lines 56Band 56C. The formation of dielectric material 67 may be performed usinga conformal deposition method such as Chemical Vapor Deposition (CVD) inorder to help the formation of air gap 68. The dielectric constant (kvalue) of air gap 68 is equal to 1.0, and hence the formation of air gap68 helps reduce the parasitic capacitance between conductive lines 56Band 56C.

Dielectric layer 67 also includes portions over etch stop layer 57.Dielectric layer 67 may also be another IMD layer. As shown in FIG. 13,conductive/metal lines 72 and via 76 (which include diffusion barrierlayers 74 and conductive material 80) are formed over and electricallycoupled to conductive lines 56. The respective process step is shown asstep 216 in the process flow shown in FIG. 14. In some embodiments, theformation of metal lines 72 and via 76 is similar to the formation ofconductive lines 56 and via 54, respectively, and hence the details ofthe formation of metal lines 72 and via 76 are not repeated herein. Insome embodiments, via 76 also includes a lower portion and an upperportion formed separately similar to the formation of lower portion 54Band upper portion 54A of via 54. In alternative embodiments, since theupper metal layers have greater spacings between metal lines than lowermetal layers, the parasitic capacitance between the metal lines in theupper metal layers is small. Accordingly, there will not be a separateprocess for forming air gaps between the metal lines in upper metallayers. Accordingly, diffusion barrier layers 74, which are parts ofmetal lines 72 and via 76, can extend underlying the metallic material80 in via 76. Via 76 in these embodiments will be formed in the sameprocess as metal lines 72, and the upper portion and the lower portionof via 76 will be formed in the same process step.

As also shown in FIG. 13, dielectric barrier layer 78 is formedencircling lower portion 54B of via 54. Dielectric barrier layer 78 isformed in a self-aligned process. For example, the formation ofdielectric layer 67, metal lines 72, and via 76 may include thermalprocesses. If needed, additional thermal process such as a thermalanneal may be performed separately. The thermal process results in theadditive elements in lower portion 54B of via 54 to diffuse to itsinterface with IMD layer 42, and form oxides with the elements in IMDlayer 42. For example, the additive elements such as Mn, Ti, and/or Mgmay form oxides with the oxygen in IMD layer 42. Hence, dielectricbarrier layer 78 may include MnO_(x), TiO_(y), MgO_(z), or combinationsthereof, wherein values x, y, and z represent the relative atomicpercentage of oxygen. Dielectric barrier layer 78 may or may not includeother elements in IMD layer 42 such as carbon. Dielectric barrier layer78 may have thickness T3 in the range from about 0.5 nm to about 2 nm.

Dielectric barrier layer 78 is self-aligned to the interface betweenlower via portion 54B and IMD layer 42 due to the existence of oxygen(for example) in IMD layer 42. On the other hand, between lower viaportion 54B and the underlying conductive feature such as cap 38 ormetal line 32, no dielectric barrier layer 78 is formed. Furthermore,dielectric barrier layer 78 is not formed around upper via portion 54A.

The embodiments of the present disclosure have some advantageousfeatures. Air gaps are formed between metal lines to reduce theparasitic capacitance. The process for forming the air gaps, such as theetching step shown in FIG. 11, however, may result in the diffusionbarrier layer to be damaged, hence compromising it function ofpreventing copper in metal lines from diffusing into IMD layers. Theconventional way of solving this problem is to increase the thickness ofdiffusion barrier layers, so that the damaged diffusion barrier layersstill have enough thickness. The diffusion barrier layers, however, havea low electrical conductivity, and the portions of diffusion barrier atvia bottoms (whose thickness is increased) cause the contact resistancebetween vias and the underlying conductive lines to increase. The RCdelay of the resulting interconnect structure is thus adverselyincreased. The embodiments of the present disclosure do not havediffusion barrier layer formed at the via bottom. As a result, thethickness of the diffusion barrier layer may be increased significantlyto ensure that the damaged diffusion barrier layers still have enoughthickness.

In accordance with some embodiments of the present disclosure, anintegrated circuit structure includes a first conductive line, adielectric layer over the first conductive line, a diffusion barrierlayer in the dielectric layer, and a second conductive line in thedielectric layer. The second conductive line includes a first portion ofthe diffusion barrier layer. A via is underlying the second conductiveline and electrically couples the second conductive line to the firstconductive line. The via includes a second portion of the diffusionbarrier layer, with the second portion of the diffusion barrier layerhaving a bottom end higher than a bottom surface of the via.

In accordance with alternative embodiments of the present disclosure, anintegrated circuit structure includes a first conductive line, adielectric layer over the first conductive line, a second conductiveline in the dielectric layer, and a via underlying the second conductiveline and electrically couples the second conductive line to the firstconductive line. The via includes an upper portion and a lower portionunderlying the upper portion. The upper portion further includes aconductive material and a diffusion barrier layer encircling theconductive material. A dielectric barrier layer encircles the lowerportion of the via.

In accordance with yet alternative embodiments of the presentdisclosure, a method includes forming a first conductive line over andelectrically connected to a semiconductor device; forming an etch stoplayer over the first conductive line; depositing a first dielectriclayer over the etch stop layer; etching a via opening in the firstdielectric layer; etching a plurality of trenches in the firstdielectric layer while extending the via opening through the firstdielectric layer; filling a portion of the via opening with a firstconductive material, the first conductive material being a firstmetallic material doped with an additive element; depositing a diffusionbarrier layer over bottoms and along sidewalls of the trenches, over thefirst conductive material in the via opening, and along exposedsidewalls of the via opening; removing portions of the diffusion barrierlayer over the first conductive material in the via opening; and fillingthe trenches and remaining portions of the via opening with a secondconductive material.

In accordance with yet alternative embodiments of the presentdisclosure, a method includes forming a dielectric layer over a firstconductive line; forming a via opening in the dielectric layer, thefirst conductive line exposed by the via opening; filling a firstportion of the via opening with a first conductive material, the firstconductive material comprising at least two conductive elements; forminga diffusion barrier layer along sidewalls of a second portion of the viaopening; filling the second portion of the via opening with a secondconductive material; and annealing the first conductive material, theannealing diffusing at least one of the conductive elements into thedielectric layer to form a dielectric barrier layer along sidewalls ofthe first portion of the via opening.

In accordance with yet alternative embodiments of the presentdisclosure, a method includes forming a dielectric layer over aconductive line, forming a trench and a via opening in the dielectriclayer, with the conductive line exposed to the via opening, and fillinga lower part of the via opening with a first conductive material to forma lower part of a via. After the lower part of the via is formed, adiffusion barrier layer is formed at a bottom and sidewalls of thetrench. After the diffusion barrier layer is formed, an upper part ofthe via is formed by filling a second conductive material in the viaopening.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: forming a first conductiveline over and electrically connected to a semiconductor device;depositing a first dielectric layer over the first conductive line;etching a via opening in the first dielectric layer; etching a trench inthe first dielectric layer while extending the via opening through thefirst dielectric layer, the via opening having a lower portion and anupper portion, the lower portion extending from the first conductiveline to an intermediate point of the via opening, the upper portionextending from the lower portion to a bottom of the trench; filling thelower portion of the via opening with a first conductive material, thefirst conductive material being a first metallic material doped with anadditive element; depositing a diffusion barrier layer over the bottomand along sidewalls of the trench, over the first conductive material,and along exposed sidewalls of the upper portion of the via opening;removing portions of the diffusion barrier layer over the firstconductive material; and filling the trench and remaining portions ofthe via opening with a second conductive material.
 2. The method ofclaim 1, further comprising: planarizing the first dielectric layer andthe second conductive material such that top surfaces of the firstdielectric layer and the second conductive material are level.
 3. Themethod of claim 2, wherein the trench is one of a plurality of trenches,and the method further comprises: etching the first dielectric layer toform an opening between a pair of the trenches; and depositing a seconddielectric layer over the trenches, an air gap remaining in the openingafter the depositing the second dielectric layer.
 4. The method of claim3, further comprising: forming a second conductive line over the airgap.
 5. The method of claim 4, further comprising: annealing the firstconductive material in the via opening, the additive element in thefirst conductive material diffusing into the first dielectric layerduring the annealing.
 6. A method comprising: forming a dielectric layerover a first conductive line; forming a via opening in the dielectriclayer, the first conductive line exposed by the via opening; forming atrench above the via opening in the dielectric layer, the trenchextending from a top of the dielectric layer to a top of the viaopening; filling a first portion of the via opening with a firstconductive material, the first conductive material comprising at leasttwo conductive elements; forming a diffusion barrier layer alongsidewalls of the trench, along a bottom of the trench, and alongsidewalls of a second portion of the via opening; filling the secondportion of the via opening and the trench with a second conductivematerial; and annealing the first conductive material, the annealingdiffusing at least one of the conductive elements into the dielectriclayer to form a dielectric barrier layer along sidewalls of the firstportion of the via opening.
 7. The method of claim 6, further whereinthe annealing the first conductive material is performed after thefilling the second portion of the via opening with the second conductivematerial.
 8. The method of claim 6, wherein the dielectric layercomprises an oxide, and wherein the annealing the first conductivematerial forms the dielectric barrier layer from an oxide of the atleast one of the conductive elements of the first conductive material.9. The method of claim 6, wherein after the annealing the firstconductive material and the dielectric layer, the dielectric barrierlayer separates the first conductive material and the dielectric layer.10. The method of claim 6, wherein the first conductive material and thesecond conductive material are different conductive materials, andwherein an interface of the first and second conductive material isdisposed in the via opening.
 11. The method of claim 6, wherein thefirst conductive material and the second conductive material are thesame conductive material.
 12. The method of claim 6, wherein the formingthe via opening in the dielectric layer comprises etching the dielectriclayer to expose a metal cap on the first conductive line.
 13. The methodof claim 6, wherein the trench is one of a plurality of trenches, andthe method further comprises: forming the plurality of trenches in thedielectric layer over the first conductive line.
 14. The method of claim13, further comprising: forming an air gap in the dielectric layerbetween the trenches; and forming a second conductive line over the airgap.
 15. A method comprising: forming a dielectric layer over a firstconductive line; forming a trench and a via opening in the dielectriclayer, with the first conductive line exposed to the via opening and thetrench disposed above the via opening; filling a lower part of the viaopening with a first conductive material to form a lower part of aconductive via; after the lower part of the conductive via is formed,forming a diffusion barrier layer at a bottom and sidewalls of thetrench, on the lower part of the conductive via, and at sidewalls of anupper part of the via opening; and after the forming the diffusionbarrier layer, filling the upper part of the via opening with a secondconductive material to form an upper part of the conductive via.
 16. Themethod of claim 15, wherein the second conductive material is furtherfilled in the trench to form a second conductive line.
 17. The method ofclaim 16 further comprising: after the second conductive line is formed,etching the dielectric layer to form an opening between a thirdconductive line and a fourth conductive line, wherein the thirdconductive line and the fourth conductive line are coplanar with thesecond conductive line; and filling the opening with a dielectricmaterial to form an air gap in the dielectric material.
 18. The methodof claim 15, wherein the first conductive material comprises a mainmetallic material and an additive element doped in the main metallicmaterial, and the method further comprises: performing a thermal processon the lower part of the conductive via, wherein in the thermal process,the additive element diffuses to the dielectric layer to form adielectric barrier with the dielectric layer.
 19. The method of claim15, wherein the forming the diffusion barrier layer comprises:performing a deposition to form the diffusion barrier layer, wherein abottom portion of the diffusion barrier layer covers a top surface ofthe lower part of the conductive via; and performing a re-sputtering onthe diffusion barrier layer, wherein the bottom portion of the diffusionbarrier layer is removed, and the top surface of the lower part of theconductive via is exposed.
 20. The method of claim 15, wherein the lowerpart of the conductive via is formed through selective plating.